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TRASPIRE R&D
Silicon die with amber compute mesh
Active Analysis Phase

Compute & Graphics
Performance Engineering

Rigorous evaluation of next-generation silicon architectures. We baseline, profile, and optimize heterogeneous workloads across leading foundry nodes.

Heterogeneous Benchmarking

Comparative analysis of discrete and integrated architectures under synthetic and real-world stress loads.

Ada Lovelace Arch

Vendor
NVIDIA
Node
TSMC 4N
TDP Target
450W – 600W

FP32 TFLOPS (Peak)

~82.6

RDNA 3 Arch

Vendor
AMD
Node
TSMC 5nm / 6nm
TDP Target
300W – 355W

FP32 TFLOPS (Peak)

~61.4

Oryon / Adreno

Vendor
Qualcomm
Node
TSMC 4nm
TDP Target
15W – 45W

NPU TOPS

~45

Workload-Specific Profiling

Detailed analysis of efficiency metrics across varied computational domains.

Workload TypePrimary MetricArch Alpha (High Perf)Arch Beta (Efficiency)Delta
Ray Tracing (RTX)Giga Rays/s191.084.2+126%
LLM Inference (INT8)Tokens/s/Watt2.45.8-58%
Rasterization (4K)FPS/Watt0.180.25-27%
Scientific ComputeFP64 TFLOPS34.011.9+186%